Qnity Electronics, Inc. (Q) | The Buildout — AI Infrastructure

——Mkt cap — · 52-wk —–— · YTD — · delayed
Updated Sep 22, 2026Q2 FY2026 reviewed
Qnity Electronics supplies the materials and consumables used to make and package AI semiconductors.
Organic +22%
Q2 2026 organic sales growth, up from +17% in Q1.
ICS +28%
Interconnect organic growth; AI platforms >50% y/y.
Guidance raised twice
FY2026 net sales now guided to $5.55-5.65B.
Top 2 = ~19%
Samsung ~11%, TSMC ~8% of FY2025 net sales.
The Buildout Takeaway
Growth is accelerating and the mix is shifting toward advanced-node materials and AI-linked interconnect platforms. The open questions are a quarter-over-quarter dip in reported adjusted EBITDA margin and a soft near-term Q3 setup.
4 analysts·4 Buy0 Hold0 Sell
Median target$180  Range $134–$189 · 8 estimates

FY2026 net sales $5.55-5.65B · adj. EBITDA $1.675-1.725B · adj. EPS $4.40-4.60 · adj. FCF $600-700M
Important: The Buildout is a data analytics platform. Content is generated by algorithms and AI agents using public filings, earnings transcripts, and market data. This is not personalized investment advice.
Our View

The Verdict

Qnity makes the chemistries, polishing pads, sealants, thermal materials and interconnect substrates that chip makers consume as they build and package semiconductors. It does not make chips itself; it sits underneath the stack. Its two segments map to the two places AI demand shows up: front-end wafer manufacturing, where advanced nodes need more process steps and more material per wafer, and back-end packaging, where larger packages, higher-layer-count boards and hotter chips need more thermal and interconnect content. Demand runs through both segments, and management frames the shift from transistor shrink to 3D stacking as the driver of that rising content.

Market Cap—
Revenue (TTM)$5.2B
Revenue Growth+19.1%
EBITDA Margin (TTM)28.3%
Net Debt$3.1B
Earnings Beats3 of 3
P/E (TTM)—
EV/EBITDA (TTM)—

What We Like

  • Organic sales growth accelerated from +17% in Q1 2026 to +22% in Q2 2026, which management described as the ninth consecutive quarter of strong profitable organic growth.
  • Advanced nodes were about 40% of the portfolio exiting H1 2026 against an Investor Day target of 45-50%, and management said it expects to get there early.
  • The three Interconnect AI platforms - advanced packaging and interconnects, AI PCBs and thermal management - grew more than 50% y/y in both Q1 and Q2 2026.
  • Management raised full-year 2026 guidance twice in consecutive quarters; the Q2 midpoint implies 18% net sales growth and over 20% adjusted EBITDA growth.
  • About $600M of growth investment has been deployed since 2022, and management said it sees no current capacity bottleneck heading into what it expects to be long-term growth in 2027-2028.

What We’re Watching

  • Blended adjusted EBITDA margin slipped from 31.3% in Q1 2026 to 30.2% in Q2, with Semiconductor Technologies segment margin falling from ~36.4% to ~34%; management calls this product mix and advanced-node investment, not structural.
  • Q3 2026 sequential growth is guided to low single digits, and Q3 2025 included about $40M of net sales pulled forward ahead of pre-spin IT go-lives ($25M in Semi, $15M in ICS).
  • Two customers, Samsung (~11% of FY2025 net sales) and TSMC (~8%), were together about 19% of sales.
  • A 2026-07-01 debt 8-K was read as negative by watch events while management framed the related term-loan repricing as a ~$6M annualized benefit; the filing language is not in the source material.
Bottom Line

The thesis looks intact and strengthening on the growth line, with revenue accelerating and mix moving toward the highest-value, most AI-linked areas. The margin signal is the soft spot: reported adjusted EBITDA margin dipped quarter-over-quarter even as sales accelerated, and management's mix-and-timing explanation will be tested in the second half. Concentration in two large customers is the standing risk. The open question is whether the Q2 margin dip proves to be a mix artifact or the start of a lower structural margin.

Next upThe next checkpoint is the Q3 2026 print, guided to low-single-digit sequential growth against an approximately $40M prior-year comparison, which tests whether underlying demand is intact. The CFO transition takes effect Oct 1, 2026.
Last Quarter — Q2 FY2026

Earnings Beat

In Q2 2026 (quarter ended June 30), net sales were $1,429M, up 22% y/y and 9% sequentially, with gross margin of 46.6%. As-reported EBITDA was $373M at a 26.1% margin. Management separately reported adjusted operating EBITDA of $431M, up 24% y/y at a 30.2% margin, and adjusted EPS of $1.19, up 53% y/y. Interconnect Solutions was the standout: net sales of $685M, up more than 30% y/y, with organic growth of 28%.

MetricQ2 FY2026Q1 FY2026Q2 FY2025YoY
Revenue$1.4B$1.3B$1.2B+22.1%
Gross margin46.6%43.0%41.9%+470bps
EBITDA$373M$397M$340M+9.7%
EPS$0.59$0.72$0.90−34.3%
Adjusted EPS$1.19$1.08n/a+53% y/y
The best proof of this differentiated position is our performance.— Jon Kemp, CEO, 2026-08-04

Management tone: Management's tone was consistent across the two calls in the source material; the substance escalated rather than the tone changing. The second consecutive guidance raise came with new quantified disclosures: advanced-node mix near 40% exiting H1 and about $600M of cumulative growth investment since 2022. On analyst Q&A, management reframed questions on Q4 sequential growth and the advanced-node growth rate rather than giving direct numbers, while answering questions on margin, capacity and capital allocation directly. Management declined to guide 2027, saying it was a little too early to speculate.

Management Guidance

For full-year 2026, management guides net sales of $5.55-5.65B, adjusted operating EBITDA of $1.675-1.725B, adjusted EPS of $4.40-4.60 and adjusted free cash flow of $600-700M. At the midpoint, that implies 18% net sales growth, over 20% adjusted EBITDA growth and 35% adjusted EPS growth for the full year. For Q3 2026, management guides overall sequential net sales growth of low single digits, with Semiconductor Technologies low single digits at a mid-30s EBITDA margin and Interconnect Solutions mid-single digits at a high-20s margin. Management carries an approximately $20M input-cost headwind for 2026, half through in H1 and the remainder in H2, largely offset by pricing, and says capital expenditure stays elevated in 2026 (~9% of sales) before returning to about 6% of sales longer term. No formal 2027 guidance was given.

Business Trajectory

Trajectory

Revenue is moving up. Quarterly net sales went from $1,170M in Q2 2025 to $1,276M in Q3 2025, dipped to $1,190M in Q4 2025, then rose to $1,315M in Q1 2026 and $1,429M in Q2 2026. Organic growth accelerated from +17% in Q1 2026 to +22% in Q2. The mix is shifting toward the highest-value areas: advanced nodes were about 40% of the portfolio exiting H1, and the AI-linked Interconnect platforms grew more than 50% y/y. On margins, the computed signals show gross and operating margins expanding over the trailing period, but reported adjusted EBITDA margin eased from 31.3% in Q1 2026 to 30.2% in Q2 as Semiconductor Technologies absorbed advanced-node investment and product mix.

Revenue & Margin Trajectory
RevenueGross margin$0$500$1.0B$983M$1.1B$1.1B$1.2B$1.3B$1.2B$1.3B$1.4B44%47%Q1'24Q2Q1'25Q2Q3Q4Q1'26Q2
RevenueGross margin$0$500$1.0B$983M$1.1B$1.1B$1.2B$1.3B$1.2B$1.3B$1.4B44%47%Q1'24Q2Q1'25Q2Q3Q4Q1'26Q2
Gross margin as reported.
Share Price — 12 Months
$50$100$150$052-wk high $165Oct '25Jan '26AprJunSep '26
52-week range $74–$165.
Share Price — 12 Months
$50$100$150$052-wk high $165Oct '25Jan '26AprJunSep '26
52-week range $74–$165.
The Numbers

The Model

The model projects FY+1 revenue of $5,650M and EBITDA of $1,718M, a 30.4% margin, and FY+2 revenue of $6,600M and EBITDA of $2,072M, a 31.4% margin. The FY+1 figure sits within management's raised 2026 guidance range of $5.55-5.65B in net sales and $1.675-1.725B in adjusted operating EBITDA. The FY+2 step-up implies continued content growth in advanced nodes and the AI-linked Interconnect platforms, plus the transformation plan's run-rate benefit targeted by the end of 2028.

Revenue & EBITDA Projections
REVENUE$4.8B$5.7B$6.6BFY25FY+1 (E)FY+2 (E)EBITDA & MARGIN$1.4B$1.7B$2.1B31.4%FY25FY+1 (E)FY+2 (E)
REVENUE$4.8B$5.7B$6.6BFY25FY+1 (E)FY+2 (E)EBITDA & MARGIN$1.4B$1.7B$2.1B31.4%FY25FY+1 (E)FY+2 (E)
Solid bars are reported actuals; outlined bars are model projections — not company guidance.
MetricFY2025Next FY (E)Following FY (E)
Revenue$4.8B$5.7B$6.6B
YoY Growth—+18.8%+16.8%
EBITDA$1.4B$1.7B$2.1B
EBITDA Margin29.2%30.4%31.4%

Projections are the median of 5 independent model runs. The model’s revenue sits 11.5% above analyst consensus.

For full-year 2026, management guides net sales of $5.55-5.65B, adjusted operating EBITDA of $1.675-1.725B, adjusted EPS of $4.40-4.60 and adjusted free cash flow of $600-700M. At the midpoint, that implies 18% net sales growth, over 20% adjusted EBITDA growth and 35% adjusted EPS growth for the full year. For Q3 2026, management guides overall sequential net sales growth of low single digits, with Semiconductor Technologies low single digits at a mid-30s EBITDA margin and Interconnect Solutions mid-single digits at a high-20s margin. Management carries an approximately $20M input-cost headwind for 2026, half through in H1 and the remainder in H2, largely offset by pricing, and says capital expenditure stays elevated in 2026 (~9% of sales) before returning to about 6% of sales longer term. No formal 2027 guidance was given.

What Could Go Right — and Wrong

What good looks like
  • Advanced-node mix reaches the 45-50% Investor Day target ahead of plan while advanced-node growth holds above 20%.
  • The three Interconnect AI platforms keep growing more than 50% y/y and the company discloses a revenue share for them.
  • The Q2 adjusted EBITDA margin dip reverses as volume and the transformation program scale.
  • The NVIDIA R&D collaboration and Apple American Manufacturing Program inclusion convert into production volume or design wins.
  • A bolt-on acquisition in advanced packaging or thermal management materializes from the active pipeline, and no binding capacity constraint appears into the 2027-2028 ramp.
What could go wrong
  • Samsung or TSMC pulls in advanced-node spend or shifts material sourcing, given the approximately 19% combined FY2025 concentration.
  • The Semiconductor Technologies margin reset proves structural rather than mix and timing, keeping blended margin below the Q1 2026 level.
  • Competition from Entegris, Element Solutions and MKS Instruments intensifies and compresses the volume and price spread.
  • Consumer electronics, automotive or industrial demand rolls over enough to offset AI-led strength, with Q4 inventory control adding to the softness.
  • Input-cost pressure runs broader than the approximately $20M carried, and the balance sheet's roughly 2x net leverage limits flexibility if demand wobbles.
What’s Next

Looking Ahead

Over the next 12 months, the main checkpoints are the Q3 2026 print against a low-single-digit sequential guide and an elevated prior-year comparison, the CFO transition on Oct 1, 2026, and IT separation reaching about two-thirds of sites by the end of 2026. The Taiwan site is targeted to be fully operational in early 2027, adding CMP-materials capacity. The transformation plan's approximately $100M EBITDA run-rate benefit is weighted to the back half of 2027, and management declined to guide 2027 while saying it was stacking up nicely.

Catalysts
  • Q3 2026Q3 earnings print — Tests low-single-digit sequential guide against an elevated prior-year comp.
  • Oct 1, 2026CFO transition — Ken Rizvi becomes CFO, closing the interim-CFO period.
  • End of 2026IT separation milestone — About two-thirds of sites moved to own systems, cutting TSA reliance.
  • Early 2027Taiwan site operational — Adds CMP-materials capacity for advanced-node demand.
  • H2 2027Transformation savings — Weighted portion of the transformation plan's EBITDA run-rate benefit, by end-2028.
  • Next 1-2 yearsAdvanced-node mix target — Mix toward 45-50% of portfolio from ~40% exiting H1.
Numbers

Financials

Annual Summary

MetricFY2025TTM
Revenue$4.8B$5.2B
Gross Margin41.9%43.2%
EBITDA$1.4B$1.5B
EBITDA Margin29.2%28.3%
Net Income$692M$586M
Free Cash Flow$988M$825M
Net Cash——

Key Ratios (Trailing)

Valuation
  • P/E TTM—
  • EV/EBITDA TTM—
  • EV/Revenue TTM—
  • Price/FCF TTM—
Profitability
  • Gross Margin (TTM)43.2%
  • EBITDA Margin (TTM)28.3%
  • Net Margin (TTM)11.2%
  • ROIC8.3%
  • FCF Conversion56.0%
  • SBC / Revenue0.5%
Reference

The Company

Qnity makes the materials and consumables that go underneath the semiconductor and electronics stack: the cleans, CMP slurries and pads, lithographic materials, specialized sealants, thermal materials and interconnect substrates that chip makers consume. Its products matter because the shift from transistor shrink to taller 3D stacks raises the number of process steps and the material content per device and package. The company reports through two segments: Semiconductor Technologies, whose products are used across multiple stages of semiconductor manufacturing, and Interconnect Solutions, whose products handle signal integrity, thermal and power management and advanced packaging.

Qnity operates a global manufacturing footprint with application labs, and it is building out capacity itself. It opened a 385,000 sq ft Delaware facility in March 2026, with the first line operational and in customer qualification, and is building a $61.5M Taiwan site for production, clean rooms, warehousing and R&D labs, targeted to be fully operational in early 2027. Both focus on CMP consumables, which management calls the fastest-growing part of the Semiconductor Technologies segment. About $600M of growth investment has been deployed since 2022, described as modular expansions done in step with customer roadmaps. The company is also running a multiyear transformation plan, including IT independence and warehouse consolidation, aimed at an approximately $100M EBITDA run-rate benefit by the end of 2028.

Business Segments

Semiconductor Technologies
$744M Q2 2026 net sales
Materials used across multiple stages of semiconductor manufacturing, including CMP pads, slurries and cleans, and lithographic materials.
Growth driver: Advanced-node materials intensity
Interconnect Solutions
$685M Q2 2026 net sales
Materials for signal integrity, thermal and power management and advanced packaging, including AI PCBs and thermal management.
Growth driver: AI packaging, PCB and thermal content

Competitive Landscape

The 10-K names Entegris, Merck KGA, Resonac, Element Solutions and MKS Instruments as Qnity's most notable competitors.

  • Entegris
    Named in the 10-K as a competitor; also flagged as a possible supplier in lower-confidence wiring data.
  • Merck KGA
    Named in filings; not discussed.
  • Resonac
    Named in filings; not discussed.
  • Element Solutions
    Named in filings; not discussed.
  • MKS Instruments
    Named in filings; not discussed.
All five competitor names come from the 10-K; the Entegris dual-role flag comes from lower-confidence wiring data.

Supply Chain

Qnity sits between raw-material and chemical suppliers and the chip makers that consume its materials. DuPont supplies it under transitional agreements following the spin-off. Two customers, Samsung and TSMC, were together about 19% of FY2025 net sales.

Supplier
Transitional supply agreements and shared services post spin-off.
Supplier
Cabot Corp
Fumed silica, an abrasive for CMP slurry (wiring-sourced).
Supplier
Dow
Specialty chemical intermediates, polymers and resins (wiring-sourced).
Supplier
Polyurethane raw materials for CMP pad manufacturing (wiring-sourced).
→
Qualification-gated advanced-node materials
Q
Materials and consumables for semiconductor manufacturing and advanced packaging.
→
Samsung Electronics
~11% of FY2025 net sales
Disclosed FY2025 customer concentration.
TSMC
~8% of FY2025 net sales
Disclosed FY2025 customer concentration.
2025 ASE Best Supplier Award for its silicone-based materials.
Apple
Included in Apple's American Manufacturing Program; AMP products listed as semiconductor materials.
Materials R&D collaboration for next-gen AI, HPC and advanced packaging.

Analysis updated Sep 22, 2026, reviewing Q2 FY2026. Prices delayed. Built with The Buildout’s published methodology. Not investment advice. No positions held. © The Buildout 2026.

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