Earnings/Recap
AMKRAmkor Technology, Inc.

Earnings Recap — Q2 FY2026

CY Q3 2026 · Reported July 27, 2026 · Beat 5 of last 6 quarters

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What this means for the buildout

Amkor's record computing revenue and the new HDFO CPU ramp underscore the accelerating demand for advanced packaging in AI data center buildouts. The TSMC and NVIDIA partnerships signal deeper supply chain integration and capacity commitments, positioning Amkor as a critical node in the U.S. advanced packaging ecosystem. The company's capacity expansion across Arizona, Korea, and Vietnam aligns with the multi-year AI infrastructure investment cycle.

Results vs consensus
EstimateActualvs est
Revenue$1.81B$1.90B+4.6%beat
EPS$0.47$0.70+48.9%beat
What was said

Amkor delivered record Q2 revenue of $1.9 billion, up 26% year-over-year, with all end markets growing. Computing and automotive/industrial both set quarterly records, with computing up 20% sequentially on AI data center demand and automotive/industrial up 17% on ADAS strength. Gross margin expanded to 16.8%, and EPS of $0.70 more than tripled year-over-year. The company announced a 10-year advanced packaging agreement with TSMC and a multi-year strategic partnership with NVIDIA, and issued $1.15 billion of 0% convertible debt in May.

Key metrics
Revenue
$1.9B
Record Q2 revenue, up 26% YoY, up 13% QoQ, above guidance
EPS
$0.70
More than tripled YoY, driven by higher utilization and mix
Gross Margin
16.8%
Expanded >250 bps sequentially, two-thirds volume/utilization, one-third mix
Computing Revenue
Record
Up 20% sequentially, driven by AI data center demand; expected to grow ~30% in Q3
Utilization
High 70s%
Improved from 50s to 70s in H1; several platforms at full capacity
Management outlook

Management guided Q3 revenue to $1.95B–$2.05B, with gross margin expanding to 18.5%–19.5% driven by a richer mix of advanced technologies and continued operating leverage. Computing revenue is expected to accelerate to nearly 30% sequential growth in Q3, driven by AI data center demand and the HDFO CPU ramp, while communications is expected to decline high single digits sequentially due to the SiP move to Vietnam, memory supply constraints, and build pattern changes. The SiP headwind is expected to extend into Q4 and the first half of 2027. Full-year CapEx remains $2.5B–$3.0B, with Phase 1 of Arizona now fully committed and construction continuing to progress.

From the call

As advanced packaging, becomes increasingly strategic, customers are placing greater emphasis on manufacturing scale, technology leadership and supply chain resiliency.

on Advanced packaging strategic importance

The level of long-term collaboration and visibility we are experiencing today is meaningfully different from previous industry cycles.

on Customer engagement

Our projections now show Phase 1 as fully committed.

on Arizona capacity

What analysts asked

On the smartphone outlook, you are guiding down versus normal. Could you go through between Android and iOS, your expectation? And is the SiP move a timing issue that swings the build up in Q4?

Kevin Engel explained that roughly half of the Q3 communications decline is due to market-driven dynamics (memory constraints and build patterns) and half is due to the SiP move to Vietnam. The SiP headwind is not a one-quarter dynamic and will extend into Q4 and the first half of next year. Android weakness is driven by materials and overall demand, while iOS has different dynamics.

As you do R&D work with NVIDIA, what is the impact to R&D and operating expense, and when does the $1.5 billion prepayment come on to the balance sheet?

Kevin Engel said there is no step-function change in R&D spend; it will remain at 3%–5% of capital. The prepayment will be received in 2027 and returned to the customer as services are provided in the U.S., with the agreement expected to last 5–10 years.

Could we bridge the gross margin going up 220 basis points sequentially? What is the impact of SiP and utilization expectation?

Kevin Engel and Megan Faust explained that Q2 gross margin expansion was two-thirds volume/utilization and one-third mix. For Q3, the expansion is predominantly driven by product mix, as the compute ramp accelerates and communications declines.

Potential supply chain impact
TSMThe 10-year advanced packaging agreement with TSMC could deepen Amkor's role in TSMC's U.S. supply chain, potentially driving incremental advanced packaging and test revenue.
AVGOAs a customer of Amkor's assembly and test services, Broadcom could benefit from Amkor's expanded advanced packaging capacity, particularly for AI networking and custom compute.
QCOMQualcomm, a major Amkor customer, may be impacted by the communications softness and SiP transition, though the move to Vietnam could improve long-term cost competitiveness.
CRDOCredo, which uses Amkor for packaging, could benefit from Amkor's advanced packaging capacity expansion for AI networking applications.
LSCCLattice, a customer of Amkor's assembly services, may see improved supply chain resilience as Amkor expands capacity.
ASXASE, a direct competitor, may face increased competition as Amkor scales advanced packaging capacity and secures strategic partnerships with TSMC and NVIDIA.