SCHMID Group N.V. Class A Ordinary Shares (SHMD) | The Buildout — AI Infrastructure

——Mkt cap — · 52-wk —–— · YTD — · delayed
Updated Sep 22, 2026Q2 FY2026 reviewed
SCHMID Group supplies equipment, software, and services for PCB, substrate, glass, and photovoltaic manufacturing — the tools used to make the larger AI and high-performance computing substrate panels.
Order intake €96.6M
YTD through mid-Aug 2026; €52.3M in roughly eight weeks of Q3.
Backlog €89M
Called 'pretty much a record' vs €51M at end-2025.
AI mix 60%→70%
Share of trailing-12-month order intake, guided to ~70% by end-2026.
EBITDA guide cut
FY2026 adjusted EBITDA margin guided to 6-9%, down from >12%.
The Buildout Takeaway
The order book is accelerating while profitability guidance has been cut. The central question is whether record orders convert into earnings.
FY2026: revenue at least €100M · gross margin >12% · adjusted EBITDA margin 6-9% · order intake €125-150M, expecting upper half.
Important: The Buildout is a data analytics platform. Content is generated by algorithms and AI agents using public filings, earnings transcripts, and market data. This is not personalized investment advice.
Our View

The Verdict

SCHMID Group supplies equipment, software, and services for PCB, substrate, glass, and photovoltaic manufacturing, focused on the highest end of those markets. Its wet-process and panel-level packaging tools are used to make the larger substrates and boards that AI and high-performance computing demand. It does not own data-center infrastructure; its role is as a capital-equipment supplier to the companies that build substrate and PCB capacity.

Market Cap—
Revenue (TTM)$164M
Revenue Growth−1.9%
EBITDA Margin (TTM)-8.0%
Net Debt$101M
P/E (TTM)—
EV/EBITDA (TTM)—

What We Like

  • Order intake reached €96.6M YTD through mid-August 2026, including €52.3M in roughly eight weeks of Q3.
  • Order backlog rose to €89M, called 'pretty much a record,' versus €51M at end-2025 and €49M at Q1 2026.
  • AI infrastructure and optical modules were about 60% of trailing-12-month order intake, guided toward about 70% by end-2026.
  • Debt was reduced from €53M to about €23M via a €30.8M debt-to-equity swap, with €33M of new net capital raised.
  • The China campus consolidation targets effective capacity from roughly €50M to roughly €100M of revenue capability at about €11M investment, operational by Q4 2027.

What We’re Watching

  • FY2026 adjusted EBITDA margin guidance was cut to 6-9% from 'significantly above 12%' in the same window that order-intake guidance was raised.
  • H1 2026 gross margin was 21.2%, below expectations, and management's expected H2 reversal to more German production is untested.
  • H1 2026 operating cash outflow was €29.3M, including €26M of working-capital investment, against a May guide of about €20M for the full year.
  • Customer concentration is high: two customers were about 19% of FY2025 revenue and ten were about 60%, with the order surge tied to flip-chip BGA substrate and AI server board capacity.
Bottom Line

The demand side is strengthening, but the earnings conversion is weakening. The thesis depends on whether H2 2026 gross margin reverses and whether the €89M backlog converts in 2027 at better contribution margins. The open question is whether the margin shortfall is temporary mix and scale, as management says, or structural.

Next upThe next test is the H2 2026 gross-margin reversal management expects as China mix shifts back to German production. Quarterly order-intake updates are the next read on whether the raised €125-150M guidance remains on track.
Last Quarter — Q2 FY2026

Earnings

In the financial facts block's latest trailing quarter, Q2 FY2026, revenue was $53.6M, gross margin was 25.2%, and EBITDA was -$2.7M.

MetricQ2 FY2026Q4 FY2025Q2 FY2024YoY
Revenue$54M$58M$16M+237.1%
Gross margin25.2%35.5%19.0%+620bps
EBITDA−$3M$7M−$37M−92.7%
EPS$-0.87$-1.64$-1.20−27.2%
Order intake (Q3 to date, ~8 weeks)€52.3M€13.6M (Q1 2026)n/a—
Order backlog€89M€49M (Q1 2026)n/a—
We now expect 6% to 9% margin EBITDA margin adjusted EBITDA margin for the full year.— Arthur Schütz, CFO, 2026-08-25

Management tone: On the May 2026 call, management was confident and technology-forward, reaffirming guidance around AI, panel-level packaging, and glass core. On the August 2026 H1 call, management stayed constructive on orders but was more sober on profitability, stating the adjusted EBITDA guide cut in plain language and leaning into concrete mechanics like capacity, capex, and working capital. The medium-term margin target from May was not restated in August.

Management Guidance

Management guided FY2026 revenue of at least €100M, gross margin >12%, adjusted EBITDA margin of 6-9%, and order intake of €125-150M, expecting the upper half. It also said Sprint 2 targets at least 5% of purchasing expenses, with most savings by year-end 2026, and that China campus construction should start in about one to two months with the facility operational by Q4 2027.

Business Trajectory

Trajectory

The trailing data show a business with volatile revenue and negative EBITDA. TTM revenue is $164.3M, TTM EBITDA is -$13.2M (-8.0%), TTM net income is -$147.7M, and TTM free cash flow is -$37.6M. In Q2 FY2026, revenue was $53.6M with a 25.2% gross margin and -$2.7M EBITDA, compared with Q2 FY2024 revenue of $15.9M, 19.0% gross margin, and -$37.0M EBITDA. The order side is inflecting, with €96.6M YTD order intake, €52.3M in roughly eight weeks of Q3, and an €89M backlog. Management attributes the H1 2026 gross-margin miss to lower scale and a shift toward China, expecting a reversal in H2.

Revenue & Margin Trajectory
RevenueGross margin$0$20$40$0M$48M$52M$44M$55M$16M$34M$19M$58M$54M0%25%crosses into profitQ4'21Q2'22Q4Q2'23Q4Q2'24Q4Q2'25Q4Q2'26
RevenueGross margin$0$20$40$0M$48M$52M$44M$55M$16M$34M$19M$58M$54M0%25%crosses into profitQ4'21Q2'22Q4Q2'23Q4Q2'24Q4Q2'25Q4Q2'26
Gross margin as reported.
Share Price — 12 Months
$5$10$052-wk high $10Sep '25DecMar '26JunSep '26
52-week range $2–$10.
Share Price — 12 Months
$5$10$052-wk high $10Sep '25DecMar '26JunSep '26
52-week range $2–$10.
The Numbers

The Model

The model's locked projections are FY+1 revenue of 112M and EBITDA of 9M (8.0%), and FY+2 revenue of 145M and EBITDA of 19M (13.0%). The near-term anchor is the order book, including the €89M backlog and €125-150M FY2026 order-intake guidance. FY+2 assumes conversion of that backlog and new panel-level packaging demand, with management's mix benefit framed as a 2027 story.

Revenue & EBITDA Projections
REVENUE$164M$112M$145MTTMFY+1 (E)FY+2 (E)EBITDA & MARGIN−$13M$9M$19M13.0%TTMFY+1 (E)FY+2 (E)
REVENUE$164M$112M$145MTTMFY+1 (E)FY+2 (E)EBITDA & MARGIN−$13M$9M$19M13.0%TTMFY+1 (E)FY+2 (E)
Solid bars are reported actuals; outlined bars are model projections — not company guidance.
MetricTTMNext FY (E)Following FY (E)
Revenue$164M$112M$145M
YoY Growth—−31.8%+29.5%
EBITDA−$13M$9M$19M
EBITDA Margin-8.0%8.0%13.0%

Projections are the median of 5 independent model runs.

Management guided FY2026 revenue of at least €100M, gross margin >12%, adjusted EBITDA margin of 6-9%, and order intake of €125-150M, expecting the upper half. It also said Sprint 2 targets at least 5% of purchasing expenses, with most savings by year-end 2026, and that China campus construction should start in about one to two months with the facility operational by Q4 2027.

What Could Go Right — and Wrong

What good looks like
  • The €89M backlog converts into revenue at higher contribution margins in 2027.
  • H2 2026 gross margin reverses as China mix shifts back toward German production.
  • AI and optical module mix reaches about 70% of order intake by end-2026, supporting pricing.
  • The China campus doubles effective capacity toward roughly €100M of revenue capability by Q4 2027.
  • A glass-core qualification milestone or volume order arrives, validating the highest-value part of the panel-level packaging story.
What could go wrong
  • FY2026 adjusted EBITDA margin lands at the low end of 6-9%, showing the margin shortfall is structural rather than temporary.
  • Working capital stays near 14% of LTM sales and European guarantees remain unavailable, keeping cash consumption high.
  • Customer concentration and lumpiness cause order intake to swing sharply, as Q1 2026's €13.6M intake showed.
  • Labor constraints in Germany and China capacity that is not solved until Q4 2027 limit the conversion of orders into revenue.
  • Glass-core qualification slips, delaying the highest-value part of the panel-level packaging roadmap.
What’s Next

Looking Ahead

The next 12 months turn on whether H2 2026 gross margin reverses and whether order intake remains near the raised guidance level. Management's dated milestones include Sprint 2 purchasing savings by year-end 2026, China campus construction starting around Sept/Oct 2026, Nasdaq monitoring ending February 2027, and the China campus operational by Q4 2027. Glass-core qualification remains the key binary watch item, and management frames the mix benefit as a 2027+ story.

Catalysts
  • H2 2026Margin mix reversal — Management expects China mix to reverse to more German production.
  • Sept/Oct 2026China construction start — Zhongshan campus build expected to start; about €11M spend over about 12 months.
  • Year-end 2026Sprint 2 savings — Most purchasing savings targeted by year-end 2026.
  • February 2027Nasdaq monitoring ends — Higher filing requirements end after this period.
  • 2027Mix-benefit inflection — Management frames the margin mix benefit from semiconductor customers as a 2027+ story.
  • Q4 2027China campus operational — New capacity expected online; targets about €100M revenue capability.
Numbers

Financials

Key Ratios (Trailing)

Valuation
  • P/E TTM—
  • EV/EBITDA TTM—
  • EV/Revenue TTM—
  • Price/FCF TTM—
Profitability
  • Gross Margin (TTM)23.9%
  • EBITDA Margin (TTM)-8.0%
  • Net Margin (TTM)-89.9%
  • ROIC-29.7%
  • SBC / Revenue0.0%
Reference

The Company

SCHMID Group N.V. supplies equipment, software, and services for PCB, substrate manufacturing, glass, and photovoltaics, focused on the highest end of those markets. Its machines perform wet-process steps such as developing, etching, stripping, plating, and chemical mechanical polishing for panel-level packaging. AI and high-performance computing are driving larger compute packages and a shift from wafers to rectangular panels, and SCHMID sells the tools used to make those panels.

The company was founded in 1864 in Freudenstadt, Germany, and describes itself as a fifth-generation family-controlled business. It has production in Freudenstadt and Zhongshan, China, and a facility in Malaysia that is expanding. Capital intensity is low, with CapEx historically around €1M or less because the business does a lot of assembly work. It is consolidating two leased China sites into one owned campus.

Business Segments

Technical equipment and processes
FY2025 revenue €54,446k
Sale of machines including installation, long-term development and extended warranties.
Growth driver: AI/HPC panel-level packaging shift
Spare parts and services
FY2025 revenue €11,885k
Sale of spare parts, repairs, modifications of machines and inspections.
Growth driver: Installed base service demand

Competitive Landscape

The 20-F names MKS Instruments, Inc. among its key competitors and Shenzhen SC New Energy Technology Corp in photovoltaics. It also says Process Automation International Limited, Top Creation Machines Co., Ltd., Universal Circuit Board Equipment Co., Ltd., Almex Technologies Inc., and Manz Asia offer products that compete with its plating equipment products. Management describes the company as a 'trusted equipment provider for the electronics industry' with more than 60 years in panel-level packaging.

  • MKS Instruments, Inc.
    20-F names it among key competitors; described as a NASDAQ-listed multinational.
  • Shenzhen SC New Energy Technology Corp
    20-F says it competes in the photovoltaics market.
  • Process Automation International Limited
    Named in 20-F as offering products that compete with plating equipment; not discussed.
  • Top Creation Machines Co., Ltd.
    Named in 20-F as offering products that compete with plating equipment; not discussed.
  • Universal Circuit Board Equipment Co., Ltd.
    Named in 20-F as offering products that compete with plating equipment; not discussed.
Names from the 20-F. The filing also lists Almex Technologies Inc. and Manz Asia as plating-equipment competitors.

Supply Chain

SCHMID sits upstream in the AI infrastructure chain as a capital-equipment supplier to substrate and PCB makers. It does not own data-center, power, or cooling infrastructure. No neighbor transcript in the evidence set mentioned SHMD by name.

Supplier
TRUMPF
TGV process cooperation; wiring lists it as supplier of through-glass via laser drilling technology.
→
Premium-yield equipment supplier
SHMD
Wet-process and panel-level packaging equipment.
→
Two largest customers
~19% of FY2025 revenue
Unnamed; concentration disclosed.
Ten largest customers
~60% of FY2025 revenue
Unnamed.
US based customer
Received first InfinityLine H+ for 700×700 mm panel-level packaging.
Flip-chip BGA substrate makers
Order intake driver.
AI server board makers
Order intake driver.

Analysis updated Sep 22, 2026, reviewing Q2 FY2026. Prices delayed. Built with The Buildout’s published methodology. Not investment advice. No positions held. © The Buildout 2026.

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